Makes breakthroughs in key process technologies such as bonding technology, thick sacrificial layer sealing technology, diaphragm technology, and microporous deep silicon etching.

Masters the complete set of integration process technologies for silicon-based micro digital speaker products.

Makes breakthroughs in key process technologies such as the deposition of high uniformity scandium-doped aluminum nitride films, patterning, microporous and deep trench etching structures.

Masters the complete set of integration technologies of micro piezoelectric microphone products.