SITRI boasts a rich array of specialized process capabilities, including various types of multi-layer wafer bonding, vanadium oxide and aluminum nitride thin film deposition, multiple dry film processes, TSV (Through Silicon Via) technology, sacrificial layer release, metal lift-off process, ion implantation, wafer back processing and chemical mechanical polishing. Its related process technologies are advanced and can meet the manufacturing requirements of a wide range of MEMS smart sensors and other chips.