From the perspective of the technology stack, the system integration department focuses on (the orange part in the figure):

• The hardware modular design and manufacturing of new types of sensors and actuators, including: amplification and conditioning of weak sensor signals (AFE, Analog Front End), filters, sensor calibration and adjustment, etc.

• BSP support and manufacturing for hardware drivers, signal interfaces, etc., including: sensor ADC acquisition cards (DAQ, Data Acquisition), MEMS device drivers for sound/light/electricity, RF and wireless transmission modules, etc.

• The Hardware Abstraction Layer (HAL): serves as a bridge between hardware and software, such as in the development of RTOS-based drivers, data communication, and protocol stack support, etc.

• Algorithm library: including items such as FPGA-based high-speed data channels, DSP-based digital filters and spectrum analysis, and embedded AI edge computing.