Innovative Assembling and Testing Technology Seminar

Shanghai Industrial μTechnology Research Institute organize “Innovative Assembling and Testing Technology Seminar”. The user-oriented seminar during the Sensor China 2015 exhibition has gained praise from users and exhibitors. It is a high-class, forward-looking conference and focusing on intelligent manufacturing, assembling and testing.

The seminar was the concurrent event aiming at the fields of aerospace, automotive, defense electronics, petrochemical, pharmaceutical, transportation, power electronics. It will put stress on sensors, test and measurement products and technology.


Innovative Assembling and Testing Technology Seminar
Time Topic Speaker
9:30-10:15 Keynote Speech: One-stop Packaging and Testing Program Choon Heung Lee, CTO


10:15-10:45 Silicon Packaging Technology Zhi Wang

Director of Product Management


10:45-11:15 IoT Device Testing and its Challenges Dejia Kong,

Business Development Manager


11:15-11:45 Assembly Technology Evolvement in IoT era Edward Yang Ph.D.

Process Engineering Director

ASE Group

11:45-13:00   Lunch
13:00-13:30 IoT Drives Demand for 3DIC Russell Liu, VP


13:30-14:00 The New Package Application for IoT Jack Tu, R&D VP


14:00-14:15   Tea Break
14:15-14:45 Wafer Level Integration towards 3DIC: Status and Prospectus Herb Huang, Senior Director


14:45-15:15 Advanced Fingerprint Assembling Jianyou Xie, President

Hua Tian Xi’an

15:15-15:45 MEMS Analysis and Testing Platform Joy Zhang, Director


15:45-16:30 Panel Discussion Speakers

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